The Galaxy S9 Android Pie build was leaked and it definitely gave some insights about a few upcoming Samsung devices. The firmware had some references to the company’s very first foldable smartphone and Qualcomm’s next flagship chipset and all this time, we kept on believing that it was the Snapdragon 855. Turns out the SoC manufacturer’s first 7nm FinFET silicon will be called the Snapdragon 8150 and what is interesting is that this was not the only thing discovered in the build. There is a foldable device mentioned here as well.
Leaked Firmware Files Not Only Point Towards the Snapdragon 8150, but Also Samsung’s Foldable Smartphone
A decompilation of the framework-res file of the leaked build has revealed files that mention the foldable smartphone’s expected codename and similar files point towards the marketing name for Qualcomm’s next high-end chipset.
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A reputable source’s report claimed the company’s foldable smartphone has ‘Winner’ as its codename. A file with name ‘winnerlte’ has also been discovered in the leaked firmware. The smartphone could be powered by an Exynos chipset, as Samsung used ‘q’ at the end of the codename to differentiate Snapdragon versions.
Leaked configuration files for this device were discovered only in the leaked Android Pie build, so it’s possible that this device may come with Android 9 Pie pre-running. The time of its arrival in the markets is still unknown, yet it is something to look forward to thanks to its foldable display design. We can expect Samsung to provide additional details about the foldable smartphone at SDC 2018, an event which will take place next month.
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With all the information found in the leaked Galaxy S9 Android Pie build, a policy file for an unreleased Qualcomm chipset has also been found. It talked about the marketing name for Qualcomm’s next flagship chip as Snapdragon 8150. Some expected the name to be Snapdragon 855 but Qualcomm might change the moniker when the SoC has been officially launched. The policy file will quite likely be there for the Galaxy S10, which will be the first device that expected to use this chip.
The mentions within the leaked firmware are not confirmed, so anything can be expected. The Snapdragon 8150 will be seen in action before next year and it might even be possible that commercial units of the foldable smartphone might even show up in 2019.
You might also like to check out:
- Qualcomm Has Reportedly Been Tweaking the Snapdragon 865, the Snapdragon 855 Successor, Since June 2018
- Snapdragon 855 Might Not Be the Official Name of Qualcomm’s First 7nm Chipset – New Naming Scheme Incoming?
- New Snapdragon 1000 Details Emerge – 12W TDP, 16GB RAM Support and Much Bigger Dimensions Than Other ARM Chips
Source: XDA Developers
