Now that Apple’s A12 Bionic and Huawei’s Kirin 980 have been released, all eyes are on Qualcomm, with chipset manufacturer’s executives expected to be present at an even a little late this year. According to a tipster, there are just a few more days left to go before the Snapdragon 8150 is officially unveiled.
Qualcomm’s 7nm FinFET Snapdragon 8150 Will Allegedly Be Launched During an Event in Hawaii
According to the well-known leakster Ice Universe, the Snapdragon 8150 chipset will be announced on December 4 in Hawaii during the Qualcomm Technology Summit. Apparently, invitations have already been sent out to the Chinese media, with the company is also expected to provide briefings of the 5G standard.
Related Snapdragon 8150 Dominates NPU And Compute Benchmarks
Like the A12 Bionic and Kirin 980 launched this year, the Snapdragon 8150 will be made using TSMC’s 7nm FinFET process. The SoC might follow in the footsteps of the Kirin 980, meaning that it will feature an octa-core CPU, but with a different configuration. The Snapdragon 8150 will reportedly feature two very high-performance Kryo Gold Plus cores, followed by Gold cores, and then the efficient Silver ones.
Qualcomm will release the Snapdragon 8150 processor in Hawaii on December 4th. pic.twitter.com/Ny93ADY1Rz
— Ice universe (@UniverseIce) November 21, 2018
The Gold Plus cores will allegedly provide clock speeds up to 3.0GHz, and since the Snapdragon 845’s performance cores are running at 2.80GHz (2.96GHz on the ASUS ROG Phone thanks to its superior cooling solution), Qualcomm should not experience difficulties reaching the aforementioned clock speed. The Gold ones are expected to run at a lower frequency. However, these speeds might be of a prototype or earlier version and the real speeds might be higher than what we previously reported. Lastly, the chipset will also feature a new neural processing unit.
Related Fresh Snapdragon 8150 Report Adds A Bit Of Confusion For Clusters
The Qualcomm Snapdragon 8150 chipset is expected to power a number of flagships next year, some of which are expected to arrive in March after being announced during the MWC 2019 trade show in February. The performance of Qualcomm’s upcoming chip is expected to be similar to that of Huawei’s Kirin 980.
The performance differences between the Snapdragon 835 and Snapdragon 845 weren’t that extensive, so Qualcomm is expected to launch something worthwhile in the coming months. If you want to check out our previous coverage of the Snapdragon 8150, don’t forget to check out the links below.
- Snapdragon 8150 Allegedly Beats Kirin 980 in Latest AnTuTu Leak – Comes Very Close to Overtaking the A12 Bionic
- Snapdragon 8150 Reportedly Featuring Three CPU Clusters – High Performance ‘Gold Plus’ Cores Expected
- Initial Snapdragon 8150 Alleged Benchmarks Show Significant Performance Improvements – Octa-Core Processor Seemingly Confirmed
Source: Twitter (Ice Universe)